Physical vapor deposition (PVD) is a widely used technique in semiconductor integrated circuit (IC) manufacturing.
Sputter deposition is a physical vapor deposition (PVD) method of depositing thin films by sputtering, that is ejecting, material from a “target,” that is source, which then deposits onto a “substrate,” such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment.